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Fabrication of a 600V/20A 4H-SiC Schottky Barrier Diode

机译:制造600V / 20a 4H-siC肖特基势垒二极管

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摘要

600V/20A 4H-SiC Schottky barrier diodes (SBD) were fabricated to investigatethe effect of key processing steps, especially before and after a formation ofSchottky contact, on the electrical performances of SBD and on a long-termreliability. The results show that 4H-SiC SBDs, subjected to a hydrogen-ambientannealing at 470oC for 10min and sacrificial treatment right after ionactivation, exhibited low forward voltage drop (VF) at a rated current of 20A,higher blocking voltage of 800V, and very short reverse recovery time of17.5ns. Despite a harsh reverse bias condition and temperature, a long-termreliability test shows that changes in forward voltage drop and reverse leakagecurrent (IR) were 0.7% and 8.9% and that blocking voltage was enhanced. This isattributed to a stabilized interface between passivation layer and SiC that iscaused by aging.
机译:制作了600V / 20A 4H-SiC肖特基势垒二极管(SBD),以研究关键工艺步骤(特别是在形成肖特基接触之前和之后)对SBD的电性能和长期可靠性的影响。结果表明,4H-SiC SBDs在470oC下进行氢气氛退火10min并在离子活化后立即进行牺牲处理,在20A额定电流下表现出低的正向压降(VF),较高的阻断电压800V,并且非常短反向恢复时间为17.5ns。尽管存在严重的反向偏置条件和温度,但长期可靠性测试表明,正向压降和反向漏电流(IR)的变化分别为0.7%和8.9%,并且阻断电压得到了提高。这归因于钝化层与SiC之间因老化而形成的稳定界面。

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